Electrical Reliability

The use of surface mounted electronics in demanding environments increases the importance of the solder joints’ electrical reliability.  Solder connection with disparate materials causes thermal expansion incongruities that also threaten solder joint dependability.  To counteract these conditions, Alpha’s solder material offers non-corrosivity to stop oxidation and grain structure stability to prevent accumulating fatigue damage.

Alpha products support electrical reliability:

Solder Paste

Product Lead-Free SnPb Low Temp High Reliability Low Ag Water Soluble
CVP-390 X

OM-353 X


Bar Solder

Alpha Solder Alloys

Use the chart below to determine which Alpha alloy is right for you. Simply align the type of assembly being made with the appropriate alloy.

 Assembly Type
Simple, single sided, FR2 / CEM-1 laminates
Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes
Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air
>2.4mm thick, >12 inner copper layers, large high heat capacity components
 SACX Plus 0807

 SAC alloys label for table
  1%+ flux solids, L0, pin testable
Flux Type
  SACX Plus 0307
    4%+ flux solids, L or M0, pin testable
SnCX Plus™ 07
          4%+ flux solids, L or M0, moderately pin testable
            7%+ flux solids, L,M or H1, not pin testable
0ºC to 100ºC - standard profile cycles
0ºC to 100ºC - standard and shock profile cycles
- 25ºC to 125ºC - standard and shock profile cycles
- 45ºC to 125ºC - standard and shock profile cycles
Thermal Fatigue Resistance

Liquid Solder Flux

Product Lead-Free SnPb High Reliability Low Ag Water Soluble
X X   X  
EF-6100 X X X X
EF-6100R X   X    
EF-6103 X X X X  
EF-6850HF X   X X  
EF-8000 X X X X  
EF-8300 X X X X  
EF-8800HF X   X X  
EF-9301 X X X X  
EF-12000 X X   X  
NR-205   X X    
NR-330   X      

615-25 Series   X      


(Press ctrl to select multiple)