Formable Silver Inks for In-mold Electronics

MacDermid Alpha offers a suite of state-of-the-art formable conductive Silver Inks that are ideal for In-Mold Electronics (IME) applications and are especially well-suited for end-markets such as Automotive, White Goods, Medical, Aviation & Aerospace, Smart Packaging and the Internet-of-things (IoT). 

Alpha Formable Ag Ink

These formable, conductive silver inks provide unparalleled performance benefits, including low resistance before and after thermoforming, high degree of formability, consistent print performance, resistance to ink wash off and strong adhesion to polymer substrates like Polycarbonate (PC) and PET (polyethylene terephthalate).

Formable AG InksIn addition, these inks have outstanding fine-line printing, excellent conductivity, and are suitable for high throughput, high speed printing. They are compatible with MacDermid Alpha’s range of formable Dielectric Inks and formable Adhesives, as well as commercially available graphic inks. This inter-compatible suite of formable ink products ensures that customers can produce robust, reliable, and high-performance IME products using high throughput processes.

Our highly formable, conductive silver inks are offered in several forms, including micron-silver flakes and nano-silver particles. These IME compatible silver inks are tailored to meet the varying formability needs of diverse capacitive touch applications such as smart automotive interior surfaces, white goods control panels, smart packaging sensor surfaces and similar smart HMI (human machine interface) surfaces.

MacDermid Alpha’s in-mold electronics silver inks can be applied using screen-printing technology with either polyester or stainless-steel mesh. A wide range of mesh sizes can be used. Furthermore, many compatible substrates can be used including PET, polycarbonate (PC), as well as other substrates and films suitable for in-mold electronics.

 

Formable Dielectric Ink | Inks for Printed Electronics

 
  
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