Encapsulants


ALPHA® HiTech™  Encapsulants are one component, intermediate temperature, fast heat curable materials. They are designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.


 

ALPHA® Hi-Tech™  Encapsulants are formulated for applications in portables (e.g. smartphones) requiring  extra reliability protection. Users of the ALPHA® Hi-Tech™  series of  encapsulants can benefit from the following key product features:

  • Specially formulated Thixotropic Index (TI) for optimal dispensing performance
  • Excellent non-sagging property to minimize spread after dispensing process
  • Able to impart excellent water proofing attribute
  • Prevent migration formation
  • Excellent adhesion property on FR4, Flexible Polyimide and Chip components
  • Halogen Free

Encapsulant encapsulant


EN31-4007

Solder Joint Strengthening Encapsulants

ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products prevent chip and IC devices from dropping out. For Glob Top, these protect the chip/die from cracking.

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EN21-4210

Solder Joint Strengthening Encapsulants

ALPHA® HiTech™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. It prevents chip and IC devices from dropping out. In addition, it protects the chip/die from cracking when used as a Glob Top.
 
 
  
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