ALPHA® HiTech™ UP44-5311F

Ultraviolet Cure Encapsulant

ALPHA® HiTech™ UP44-5311F is a one-component UV cure system. It is designed to improve the attachment strength of solder joints by encapsulating the material over the chips or other components. It prevents chip and IC devices from dropping out and cracking. It has the unique characteristic of appearing as fluorescent blue light when exposed to black light.

ALPHA® HiTech™ UP44-5311F are products specially designed for encapsulation. Its translucent appearance allows for visibility and inspection of the chip which is being encapsulated.

Key Features:

  • Fast Cure
  • Excellent Moisture Resistance
  • Allows Visibility for Chip Inspection
  • Excellent Adhesion
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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