Servers

Computer servers connect workstations, PCs and many other communications devices to one another locally and via the internet. This equipment is generally complex and powerful in design and requires joining materials that are highly robust and can withstand the most challenging manufacturing environments yet meet high surface insulation resistance requirements.
Servers

Key Requirements for Joining Materials

  • Product options to enable flexibility in board design and manufacturing process
  • High electrochemical reliability alone and in combination with other joining materials
  • High thermal and electrical conductivity
  • High throughput, low defects


Product Type

Product

Low Temp

PB Free

Halogen Free

Solder Paste

ALPHA® OM-363SAC305

  • Repeatable printing down to 0.4mm/.016” pitch
  • Low NWO and HIP Defects
  Pb Free Halogen Free
Solder Paste

ALPHA® OM-550 HRL1

  • Best mechanical performance of Alpha’s low temperature solder alloys
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects such as HIP and NWO
Low Temp Pb Free Halogen Free
Solder Paste

ALPHA® JP-510 SAC305

  • Jettable to 0.5mm/.020” pitch
  • High mechanical and electrochemical reliability
  Pb Free Halogen Free
Solder Paste

ALPHA® JP-501 SnBiAg

  • Low HIP and NWO Defects
  • Jettable to 0.5mm/.020” pitch
Low Temp Pb Free Halogen Free
Preforms

ALPHA® BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp

  • Increasing thermal conductivity and heat dissipation through void reduction
  • Low flux residue improves electrochemical reliability
  • Prevents mechanical stackup issues through increased solder volume
Low Temp
Pb Free Halogen Free
Preforms

ALPHA® Tape and Reel Preforms

  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux coated versions available (*some fluxes contain halogens)
Low Temp
Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® HF-850 SAC305 / SACX Plus 0307

  • Performs well with all standard pad finishes
  • Can be used in both robotic and manual soldering processes
  • ROL0
  Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® XL-825 SAC305 / SACX Plus 0307

  • Best for difficult to solder surfaces
  • Can be used in both robotic and manual soldering processes
  • ROL1
  Pb Free  
Bar and Solid Wire Solder

ALPHA® SAC305®

  • Excellent soldering performance
  • High thermal fatigue resistance
  • Widely used
  Pb Free  
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0807

  • Low Silver (0.8%) for improved value vs. SAC305
  • SAC305-like soldering and reliability performance on complex assemblies
  • Low Copper dissolution and low drossing
  Pb Free  
Liquid Flux

ALPHA® EF-6808HF

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for most standard complexity assemblies
  Pb Free Halogen Free
Liquid Flux

ALPHA® EF-8800HF

  • ORL0
  • Passes IPC J-STD-004B
  • Designed for thick, complex boards
  Pb Free Halogen Free
 
  
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