Peripherals

Peripherals include a host of electronic devices that link directly to a PC via a wired or wireless connection and provide a variety of internal and external functions related to things like audio, video (displays), printing and cursor control (mouse). Peripherals can vary widely in quality and complexity with most common using medium complexity assemblies requiring high speed, low cost manufacturing.
Alternating row colors

Peripherals
   

Key Requirements for Joining Materials

  • High performance under wide process conditions
  • Excellent value, lowers total cost of ownership
  • High mechanical and electrochemical reliability
     


Product Type

Product

Low Temp

PB Free

Halogen Free

Solder Paste

ALPHA® OM-353 SAC305 / SACX Plus 0307

  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Lowest post reflow residues of Alpha’s chemistries
  • Low HIP and NWO Defects
  • Available in low silver SACX Plus alloy(s) for improved value

Pb Free
Halogen Free
Solder Paste

ALPHA® OM-550 HRL1

  • Best mechanical performance of Alpha’s low temperature solder alloys
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects such as HIP and NWO
Low Temp
Pb Free
Halogen Free
Preforms

ALPHA® Tape and Reel Preforms

  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux coated versions available (*some fluxes contain halogens)
Low Temp Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® XL-850 SAC305 / SACX Plus 0307

  • Performs well with all standard pad finishes
  • Can be used in both robotic and manual soldering processes
  • ROL0
  Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® XL-825 SAC305 / SACX Plus 0307

  • Best for difficult to solder surfaces
  • Can be used in both robotic and manual soldering processes
  • ROL1

Pb Free  
Adhesive

ALPHA® HiTech™ SM42-1311

  • Non-Sagging
  • Excellent adhesion on FR4
  • Resists change due to high heat post application processing (i.e., wave soldering)
  Pb Free Halogen Free
Adhesive

ALPHA® HiTech™ SM42-120P

  • Non-Sagging
  • Excellent adhesion on FR4
  • Resists change due to high heat post application processing (i.e., wave soldering)
  Pb Free Halogen Free
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0807

  • Low Silver (0.8%) for improved value vs. SAC305
  • SAC305-like soldering and reliability performance on complex assemblies
  • Low Copper dissolution and low drossing

Pb Free  
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0307

  • Low Silver (0.3%) for improved value vs. SAC305
  • Low Copper dissolution and low drossing
  • Excellent for most standard assemblies

Pb Free  
Bar and Solid Wire Solder

ALPHA® SnCX Plus® 07

  • Silver free for best value of SnCu alloys
  • Low Copper dissolution and low drossing

Pb Free  
Liquid Flux

ALPHA® EF-6103

  • ORL0
  • Passes IPC J-STD-004B
  • Best for selective soldering processes
  Pb Free
Liquid Flux

ALPHA® EF-6808HF

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for most standard complexity assemblies
  Pb Free Halogen Free
Liquid Flux

ALPHA® EF-8000

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for high density board
  Pb Free  
 
  
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