Notebooks

Notebook computers available in the market today are extremely powerful with high capacity storage in a relatively small footprint. As a result, there are a wide variety of board materials, components and surface finishes being used in their assembly. Companies making notebook computers require joining materials which give them the greatest degree of flexibility in their board design.
Alternating row colors

notebook
   

Key Requirements for Joining Materials

  • High mechanical and electrical reliability
  • Fine feature capable
  • Product options to enable flexibility in board design and manufacturing process
  • Excellent value, lowers total cost of ownership
     


Product Type

Product

Low Temp

PB Free

Halogen Free

Solder Paste
ALPHA® OM-353 SAC305 / SACX Plus 0307
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Lowest post reflow residues of Alpha’s chemistries
  • Low HIP and NWO Defects
  • Available in low silver SACX Plus alloy(s) for improved value

Pb Free Halogen Free
Solder Paste

ALPHA® OM-363 SAC305

  • Repeatable printing down to 0.4mm/.016” pitch
  • Low NWO and HIP Defects

Pb Free Halogen Free
Solder Paste

ALPHA® OM-550 HRL1

  • Best mechanical performance of Alpha’s low temperature solder alloys
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects such as HIP and NWO
Low Temp Pb Free Halogen Free
Solder Paste

ALPHA® JP-510 SAC305

  • Jettable to 0.5mm/.020” pitch
  • High mechanical and electrochemical reliability

Pb Free Halogen Free
Solder Paste

ALPHA® JP-501 SnBiAg

  • Low HIP and NWO Defects
  • Jettable to 0.5mm/.020” pitch
Low Temp Pb Free Halogen Free

Preforms

ALPHA® Tape and Reel Preforms

  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux coated versions available (*some fluxes contain halogens)
Low Temp Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® HF-850 SAC305 / SACX Plus 0307

  • Performs well with all standard pad finishes
  • Can be used in both robotic and manual soldering processes
  • ROL0

Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® XL-825 SAC305 / SACX Plus 0307

  • Best for difficult to solder surfaces
  • Can be used in both robotic and manual soldering processes
  • ROL1

Pb Free Halogen Free
Underfill

ALPHA® HiTech™ CU31-3085B

  • Fast flow
  • Reworkable


Halogen Free
Encapsulant

ALPHA® HiTech™ EN31-4007B

  • Excellent Impact Bend Resistance
  • 20-day Pot Life
  • Reworkable


Halogen Free
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0807

  • Low Silver (0.8%) for improved value vs. SAC305
  • SAC305-like soldering and reliability performance on complex assemblies
  • Low Copper dissolution and low drossing

Pb Free
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0307

  • Low Silver (0.3%) for improved value vs. SAC305
  • Low Copper dissolution and low drossing
  • Excellent for most standard assemblies

Pb Free Halogen Free
Bar and Solid Wire Solder

ALPHA® SnCX Plus® 07

  • Silver free for best value of SnCu alloys
  • Low Copper dissolution and low drossing
  Pb Free Halogen Free
Liquid Flux

ALPHA® EF-6103

  • ORL0
  • Passes IPC J-STD-004B
  • Best for selective soldering processes

Pb Free Halogen Free
Liquid Flux

ALPHA® EF-6808HF

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for most standard complexity assemblies

Pb Free Halogen Free
Liquid Flux

ALPHA® EF-8000

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for high density board

Pb Free  
 
  
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