Desktops

Desktop computers have a wide range of functionality and capability without the space constraints of a notebook PC. Most are extremely powerful with high capacity storage. There are a wide variety of board materials, components and surface finishes being used in their assembly.
Alternating row colors

desktops
   

Key Requirements for Joining Materials

  • High mechanical and electrical reliability
  • Fine feature capable 
  • Product options to enable flexibility in board design and manufacturing process
  • Excellent value, lowers total cost of ownership


Product Type

Product

Low Temp

PB Free

Halogen Free

Solder Paste

ALPHA® OM-353 SAC305 / SACX Plus 0307

  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Lowest post reflow residues of Alpha’s chemistries
  • Low HIP and NWO Defects
  • Available in low silver SACX Plus alloy(s) for improved value

Pb Free Halogen Free
Solder Paste

ALPHA® OM-363 SAC305

  • Repeatable printing down to 0.4mm/.016” pitch
  • Low NWO and HIP Defect
  Pb Free Halogen Free
Solder Paste

ALPHA® OM-550 HRL1

  • Best mechanical performance of Alpha’s low temperature solder alloys
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects such as HIP and NWO
Low Temp  Pb Free Halogen Free
Solder Paste

ALPHA® JP-510 SAC305

  • Jettable to 0.5mm/.020” pitch
  • High mechanical and electrochemical reliability
   Pb Free Halogen Free
Solder Paste

ALPHA® JP-501 SnBiAg

  • Low HIP and NWO Defects
  • Jettable to 0.5mm/.020” pitch
Low Temp Pb Free Halogen Free
Preforms

ALPHA® Tape and Reel Preforms

  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux coated versions available (*some fluxes contain halogens)
Low Temp
Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® HF-850 SAC305 / SACX Plus 0307

  • Performs well with all standard pad finishes
  • Can be used in both robotic and manual soldering processes
  • ROL0
  Pb Free Halogen Free
Cored Wire

ALPHA® Telecore® XL-825 SAC305 / SACX Plus 0307

  • Best for difficult to solder surfaces
  • Can be used in both robotic and manual soldering processes
  • ROL1
  Pb Free  
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0807

  • Low Silver (0.8%) for improved value vs. SAC305
  • SAC305-like soldering and reliability performance on complex assemblies
  • Low Copper dissolution and low drossing
  Pb Free  
Bar and Solid Wire Solder

ALPHA® SACX Plus® 0307

  • Low Silver (0.3%) for improved value vs. SAC305
  • Low Copper dissolution and low drossing
  • Excellent for most standard assemblies
  Pb Free  
Bar and Solid Wire Solder

ALPHA® SnCX Plus® 07

  • Silver free for best value of SnCu alloys
  • Low Copper dissolution and low drossing
  Pb Free  
Liquid Flux

ALPHA® EF-6103

  • ORL0
  • Passes IPC J-STD-004B
  • Best for selective soldering processes
  Pb Free  
Liquid Flux

ALPHA® EF-6808HF

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for most standard complexity assemblies
  Pb Free Halogen Free
Liquid Flux

ALPHA® EF-8000

  • ROL0
  • Passes IPC J-STD-004B
  • Excellent for high density board
  Pb Free  
 
  
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