Mobile Phones and Wearable Devices

Mobile devices represent the leading edge of assembly technology due to their size and complexity. Manufacturers of mobile phones and wearable devices value high performance and sustainable solder materials, as well as, creative solutions to enable this miniaturization trend.
Alternating row colors

Alternating row colors

Cell Phone
   

Key Requirements for Joining Materials

  • High mechanical and electrical reliability
  • Fine feature capable
  • Product options to enable flexibility in board design and manufacturing process
  • Excellent value, lowers total cost of ownership

Product Type

Product

Low Temp

PB Free

Halogen Free

Solder Paste

ALPHA® OM-353 SAC305 / SACX Plus 0307

  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Lowest post reflow residues of Alpha’s chemistries
  • Low HIP and NWO Defects
  Pb Free   Halogen Free
Solder Paste

ALPHA® OM-550 HRL1

  • Best mechanical performance of Alpha’s low temperature solder alloys
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects such as HIP and NWO
 Low Temp Pb Free  Halogen Free 
Solder Paste

ALPHA® JP-510 SAC305

  • Jettable to 0.5mm/.020” pitch
  • High mechanical and electrochemical reliability
  Pb Free   Halogen Free
Solder Paste

ALPHA® JP-501 SnBiAg

  • Low HIP and NWO Defects
  • Jettable to 0.5mm/.020” pitch
 Low Temp  Pb Free  Halogen Free
Preforms

ALPHA® Tape and Reel Preforms

  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux coated versions available (*some fluxes contain halogens)
 Low Temp Pb Free  Halogen Free 
Cored Wire

ALPHA® Telecore® HF-850 SAC305 / SACX Plus 0307

  • Performs well with all standard pad finishes
  • Can be used in both robotic and manual soldering processes
  • ROL0

  Pb Free   Halogen Free
Cored Wire

ALPHA® Telecore® XL-825 SAC305 / SACX Plus 0307

  • Best for difficult to solder surfaces
  • Can be used in both robotic and manual soldering processes
  • ROL1
   Pb Free  
Underfill

ALPHA® HiTech™ CU31-3085B

  • Fast flow
  • Reworkable
    Halogen Free 
Encapsulant

ALPHA® HiTech™ EN31-4007B

  • Excellent Impact Bend Resistance
  • 20-day Pot Life
  • Reworkable
     Halogen Free
 
  
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