Package on Package

(PoP)

The high packing density of interconnections on Ball Grid Arrays (BGA) and Chip Scale Packages (CSP) is multiplied with the Package on Package (POP) design.  Functionality is enhanced while the footprint is preserved.  Alpha has engineered dip flux and dip solder paste that enables a tight process control achieved through superior process repeatability.

 
  
*
(Press ctrl to select multiple)
*