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Alpha to Showcase Latest Products for SMT Assembly at productronica, Munich, Germany

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Emma Giles
Emma.Giles@alphaassembly.com

Alpha to Showcase Latest Products for SMT Assembly at productronica, Munich, Germany

 Somerset, NJ October 11th, 2017

 Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the productronica exhibition in Munich, Germany from Tuesday 14th – Friday 17th November.

Alpha will present its latest stencils innovation, ALPHA® tensoRED® Master Tensioning Frame at the show. ALPHA® tensoRED® enables a higher and more even tension compared to ALPHA® Tetra Frame.

“Due to the innovative design of ALPHA® tensoRED®, no air pressure on the frame is needed resulting in reduced maintenance costs and improved reliability,” explained Donald Corlett, Stencils Manager for Alpha Assembly Solutions, a MacDermid Performance Solutions Business. “ALPHA® tensoRED® also delivers several printing process benefits associated with higher tension such as less paste smearing*, reduced variation in and improved positional alignment on volume deposits*”.

ALPHA® tensoRED® is now available in all common printer sizes, as well as configuration options for full 29” printer openings.

In addition, Alpha will showcase its newly developed solution for void reduction under bottom terminated components (BTC), the ALPHA® AccuFlux™ BTC-578 Preform System. The system combines ALPHA® AccuFlux™ BTC-578 Preform, solder paste, engineered stencil designs and optimized processing parameters to dramatically and consistently decrease voiding.

For more information on Alpha’s latest product technologies visit Alpha Assembly Solutions Booth at productronica Hall B3 Booth #272.

 

Productronica

Every two years the industry leaders in electronica development and production gather in Munich for a unique trade show with innovative solutions and products for the entire value chain in electronics manufacturing.

Date: Tuesday 14th – Friday 17th November 2017

Venue: Messe München, Messegelände, 81823 Munich, German

*compared to foil mounted in ALPHA® Tetra Master Frame during standard print trial testing
 
  
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