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View Products in HiTech Underfills
- ALPHA® HiTech CU21-3240 Underfill
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg and low CTE underfill with excellent reliability.
- Provides full component coverage when dispensed onto the substrate preheated at 70 - 100°C
- High Tg and Low CTE values drastically improve the ability to pass a more stringent Thermal Cycling Test condition
- Excellent Thermal Cycling Test performance
- Halogen-free and complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech CU31-2030 Underfill
ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages on printed circuit boards.
- Low Viscosity
- Room temperature flow capability
- High Glass Transition Temperature (Tg)
- Low Modulus
- Reworkable
- Excellent reliability performance
- Halogen-free and complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech CU13-3150 Underfill
A one-component, low temp thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled on printed circuit boards.
- Low Viscosity
- Fast Cure at Low Temperature
- Excellent Adhesion
- Excellent Drop Shock
- Reworkable
- Halogen-free
- Complies with RoHS Directive 2011/65/EU
- ALPHA® HiTech CU11-3127 Underfill
A one-component capillary underfill for protecting assembled chip packages on printed circuit boards. Its high Tg, low CTE properties protects the solder joints from mechanical stresses.
- Enabling fast and efficient flow properties at high temperature but must be <80°C
- Releases stress over a large area, primary stress is CTE mismatch between component and board
- High Glass Transition Temperature
- Low Coefficient of Thermal Expansion
- Halogen Free Complies with RoHS Directive 2011/65/EU
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